IBM: presents its innovations at Hot Chips 2024

(CercleFinance.com) - At the Hot Chips 2024 conference, IBM unveiled details of its new IBM Telum II processor and IBM Spyre gas pedal.


These innovations, manufactured by Samsung Foundry, aim to meet the growing power, security and scalability needs of generative AI projects, enabling customers to achieve faster, more accurate results.

Specifically, the Telum II processor features an increased frequency, a 40% larger cache memory, an integrated AI gas pedal core and a data processing unit (DPU) to improve the performance of complex IO protocols.

The optional IBM Spyre gas pedal provides additional computing capacity, enabling more robust AI ensemble methods.



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