Siemens: new solution got 3D circuit testing

(CercleFinance.com) - Siemens Digital Industries Software today introduced the Tessent Multi-die software solution.


It helps customers dramatically accelerate and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.

With this new solution, our customers can be ready for tomorrow's designs, while reducing test implementation effort and optimising the cost of manufacturing testing, it said.



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