Soitec: business agreement on POI substrates

(CercleFinance.com) - Soitec has announced signing a business agreement with Qualcomm Technologies to supply innovative piezoelectric-on-insulator (POI) engineered substrates for 4G and 5G RF filters

After several years of collaboration, this agreement is aimed at increasing the production volume of POI wafers that will be used for Qualcomm's RF filters for smartphone RF front end modules.


"Soitec POI substrates are now an important part of Qualcomm Technologies' 5G offering for mobile devices", said Bernard Aspar, Senior Executive Vice President of Soitec's Global Business Units. 


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